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Quality Control
Through many years producing wire
dies and service the different materials wire producers, we
got so much experience in wire die quality control and know
why and where quality problems are easier to happen in wire
dies.
We pay high attention to the quality of each die we make and
all our dies are 100% individually and microscopically inspected
under X-100 magnification, any defects even a very tiny crack
are completely rejected. Our quality control system requires
to check each manufacturing process from materials.
ˇńˇˇDiamond inspection: We individually
and microscopically inspect and hand select the diamonds we
purchase from reputable suppliers known for high quality stones.
Any impurities, cracks and spots can be easily detected and
rejected.
ˇńˇˇDie nib orientation: We use a device
to mark the center in the casing and die nib is easy to put
accurately in the center of casing.
ˇńˇˇMetallic powders sintering and reinforcement
for diamond and PCD blank: Sintering is a key process and
most breakage of dies is happened due to bad sintering. Our
technical know-how or component of metallic powders sintering
gives diamond and PCD blank a strong protection and best resistance
to breakage, reinforcing diamond and PCD blank to endure wire
impact for a longer time and to prolong die life. Our sintering
process is accomplished by the combination of an infrared
sensor for sintering temperatures and a sintering machine.
ˇńˇˇLaser piercing: The precision and
consistency of our die profile are improved dramatically by
our state-of-the-art laser piercing machines.
ˇńˇˇUltrasonic grinding and wire polishing:
Die profile like lubrication area (length and angle), reduction
area (length and angle) and bearing area (bearing length)
are made by the 2 processes, which are so important to die
profile good or not, a die is very easy to break if die profile
is not good. Our advanced ultrasonic die working machines
and finest hand crafted workmanship ensure the accurate die
profile and high surface finish.
ˇńˇˇInspection by microscope and Conoptica
ElectroOptical Frame CU10: All our dies are 100% individually
and microscopically inspected under X-100 magnification, and
most dies are checked by Conoptica CU10 for die profile (reduction
angle, bearing length and ovality etc.). The innovative Conoptica
quality control system makes it come true: The precision and
consistency of die geometry can be regulated to high standards.
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